Title :
System-on-System (SoS) architecture for 3-D secure imaging
Author :
Lee Sang-Jin ; Park Kyung-Chang ; Kim Yeon-Ho ; Hong Yun-ki ; You Younggap ; Cho Kyoung-Rok ; Cho Tae Won ; Eshraghian, K.
Author_Institution :
World Class Univ. (WCU) Program, Chungbuk Nat. Univ., Cheongju, South Korea
Abstract :
This paper presents an integrated approach towards a multilayered architecture based upon stacked silicon dies for image capture and secure image transmission. The System-on-System approach presented comprises CMOS imager, memory, 3-D DWT, 3-D AES and RF transmitter layer. Chips fabricated by different processes are stacked and interconnected using TSV. Compressed images from 3-D DWT are encrypted. The TSV interconnections reduce the number of output buffers and thereby reduce power consumption. The system can be implemented as a core of portable devices for image capture and secure transmission.
Keywords :
CMOS image sensors; image coding; integrated circuit interconnections; system-on-chip; 3D AES; 3D DWT; 3D secure imaging; CMOS imager; RF transmitter layer; image capture; image encryption; power consumption reduction; secure image transmission; stacked silicon dies; system-on-system architecture; Cryptography; Discrete wavelet transforms; Energy consumption; Image coding; Image communication; Power system interconnection; Radio frequency; Silicon; Through-silicon vias; Transmitters;
Conference_Titel :
SOC Conference, 2009. SOCC 2009. IEEE International
Conference_Location :
Belfast
Print_ISBN :
978-1-4244-4940-8
Electronic_ISBN :
978-1-4244-4941-5
DOI :
10.1109/SOCCON.2009.5397999
