Title :
Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)
Abstract :
The following topics were discussed: measurement techniques; system-level thermal challenges; thermal issues in opto-electronics; liquid cooling/cold plates/heat pipes; nanoscale thermal solutions; developments in thermal management materials; application and characterization of stacked die; cooling in challenging environments; compact thermal models; component/PCB interactions.
Keywords :
semiconductor device packaging; thermal management (packaging); compact thermal models; component/PCB interactions; liquid cooling/cold plates/heat pipes; measurement techniques; nanoscale thermal solutions; opto-electronics; stacked die; system-level thermal challenges; thermal issues; thermal management materials;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-8363-X
DOI :
10.1109/STHERM.2004.1291285
