DocumentCode :
3276847
Title :
Proceedings 4th Electronics Packaging Technology Conference (EPTC 2002) (Cat. No.02EX566)
fYear :
2002
fDate :
10-12 Dec. 2002
Keywords :
adhesives; assembling; electronic equipment manufacture; electronic equipment testing; failure analysis; interconnections; micromechanical devices; modelling; modules; packaging; reliability; simulation; soldering; thermal analysis; MEMS packaging; adhesives; advanced materials; electrical design; electrical test; failure analysis; interconnects; lead free solder reliability; manufacturing technologies; modules; optical components; package thermal modeling; signal integrity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2002. 4th
Conference_Location :
Singapore
Print_ISBN :
0-7803-7435-5
Type :
conf
DOI :
10.1109/EPTC.2002.1185586
Filename :
1185586
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3276847
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