• DocumentCode
    3276874
  • Title

    Smackdown: Adventures in simulation standards and interoperability

  • Author

    Elfrey, Priscilla R. ; Zacharewicz, Gregory ; Ni, Marcus

  • Author_Institution
    Kennedy Space Center, IT-C1, NASA, Cape Canaveral, FL, USA
  • fYear
    2011
  • fDate
    11-14 Dec. 2011
  • Firstpage
    3958
  • Lastpage
    3962
  • Abstract
    The paucity of existing employer-driven simulation education and the need for workers broadly trained in Modeling & Simulation (M&S) poses a critical need that the simulation community as a whole must address. This paper will describe how this need became an impetus for a new inter-university activity that allows students to learn about simulation by doing it. The event, called Smackdown, was demonstrated for the first time in April at the Spring Simulation Multi-conference. Smackdown is an adventure in international cooperation. Students and faculty took part from the US and Europe supported by IEEE/SISO standards, industry software and National Aeronautics and Space Administration (NASA) content of a re-supply mission to the Moon. The developers see Smackdown providing all participants with a memorable, interactive, problem-solving experience, which can contribute, importantly to the workforce of the future. This is part of the larger need to increase undergraduate education in simulation and could be a prime candidate for senior design projects.
  • Keywords
    IEEE standards; education; simulation; IEEE/SISO standards; National Aeronautics and Space Administration; Smackdown; industry software; inter-university activity; international cooperation; interoperability; modeling; re-supply mission; simulation education; simulation standards; undergraduate education; Computational modeling; Educational institutions; Industries; Moon; NASA; Nickel;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference (WSC), Proceedings of the 2011 Winter
  • Conference_Location
    Phoenix, AZ
  • ISSN
    0891-7736
  • Print_ISBN
    978-1-4577-2108-3
  • Electronic_ISBN
    0891-7736
  • Type

    conf

  • DOI
    10.1109/WSC.2011.6148086
  • Filename
    6148086