Title :
Line characterization and resonance mitigation in ceramic packages
Abstract :
This paper develops models for the characteristic impedance and effective permittivity of microstrip lines near ceramic walls, as well as a method for resonance suppression using lossy vias in ceramic packages
Keywords :
ceramics; electric impedance; microstrip circuits; microstrip lines; microwave circuits; packaging; permittivity; resonance; ceramic packages; ceramic walls; characteristic impedance; effective permittivity; line characterization; lossy vias; microstrip lines; resonance mitigation; resonance suppression;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564785
