DocumentCode :
3277035
Title :
Design of on-package microstrip antennas for single-chip wireless transceivers
Author :
Zhang, Y.P.
Author_Institution :
Sch. of EEE, Nanyang Technol. Univ., Singapore, Singapore
fYear :
2002
fDate :
10-12 Dec. 2002
Firstpage :
40
Lastpage :
44
Abstract :
The recent advances in single-chip solutions of wireless transceivers have called for the parallel development of compact and efficient antennas. This paper addresses the design of on-package microstrip, antennas for single-chip wireless transceivers. A microstrip antenna realized in the format of an integrated circuit ceramic ball grid array (CBGA) package measures only 15×15×1.9 mm. Results show that the on-package microstrip antenna achieved impedance bandwidth of 1% and radiation efficiency of 80%, and gain of 2 dBi at 5.6 GHz. Details of design and analysis of this on-package microstrip antenna are presented and discussed.
Keywords :
antenna radiation patterns; ball grid arrays; ceramic packaging; finite difference time-domain analysis; microstrip antennas; modelling; transceivers; 1.9 mm; 15 mm; 5.6 GHz; 80 percent; CBGA package; ceramic CBGA package; ceramic ball grid array; compact antennas; on-package microstrip antennas; single-chip wireless transceivers; Antenna measurements; Bandwidth; Ceramics; Electronics packaging; Impedance; Integrated circuit measurements; Integrated circuit packaging; Microstrip antenna arrays; Microstrip antennas; Transceivers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2002. 4th
Print_ISBN :
0-7803-7435-5
Type :
conf
DOI :
10.1109/EPTC.2002.1185594
Filename :
1185594
Link To Document :
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