DocumentCode :
3277176
Title :
An effective method of characterizing moisture desorption of polymeric materials at high temperature
Author :
Shi, Y. ; Tay, A.A.O. ; Wong, E.H. ; Ranjan, R.
Author_Institution :
Nat. Univ. of Singapore, Singapore
fYear :
2002
fDate :
10-12 Dec. 2002
Firstpage :
70
Lastpage :
75
Abstract :
Moisture diffusion characterization at high temperatures in polymeric packaging materials is important since moisture adsorption of polymeric packaging materials plays a determining role in "popcom cracking" of IC packages during the solder reflow process. Karl Fischer Titration is proposed as an effective method for characterizing moisture desorption of polymeric packaging materials in this paper. Samples of molding compound, underfill and die attach materials were preconditioned at 85C/%85RH till saturation. The rate of moisture diffusion was then measured at 5 different temperatures using both Karl Fischer Titration and Thermo-gravimetric Analysis (TGA) methods and compared. The differences at high temperatures was attributed to the outgassing of polymeric materials at high temperatures. This was confirmed using Gas Chromatography/Mass Spectrometry (GC/MS). This questioned the use of TGA or any other conventional gravimetric methods for measuring moisture desorption properties at high temperatures. The differences at lower temperatures was attributed to the low sensitivity of Karl Fischer Titration at relatively lower temperatures.
Keywords :
chromatography; desorption; diffusion; high-temperature techniques; mass spectroscopic chemical analysis; moisture; outgassing; packaging; polymers; thermal analysis; 85 degC; IC package; Karl Fischer titration; die attach material; gas chromatography/mass spectrometry; high temperature moisture desorption; moisture adsorption; moisture diffusion; molding compound; outgassing; polymeric packaging material; popcorn cracking; solder reflow process; thermogravimetric analysis; underfill material; Conducting materials; Electrodes; Integrated circuit packaging; Materials testing; Methanol; Microassembly; Moisture measurement; Polymers; Pulse width modulation; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2002. 4th
Print_ISBN :
0-7803-7435-5
Type :
conf
DOI :
10.1109/EPTC.2002.1185600
Filename :
1185600
Link To Document :
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