Camera for thermal imaging of semiconductor devices based on thermoreflectance

Author

Christofferson, James ; Shakouri, Ali

Author_Institution

Jack Baskin Sch. of Eng., California Univ., Santa Cruz, CA, USA

fYear

2004

fDate

9-11 Mar 2004

Firstpage

87

Lastpage

91

Abstract

A thermal imaging camera suitable for use on micron-sized active semiconductor devices has been developed. Based on a visible light thermoreflectance technique, this camera achieves 50mK temperature sensitivity and sub-micron spatial resolution when imaging the top metal contact layer. By using a photodiode array, sensitivity is improved over what is possible with a CCD (Charge Coupled Device) based system. Thermal imaging results of an ultra small 10 micron diameter SiGe micro-cooler is also presented.

Keywords

CCD image sensors; infrared imaging; semiconductor device testing; thermoreflectance; 10 micron; 50mK temperature sensitivity; CCD; SiGe; SiGe micro-cooler; micron-sized active semiconductor devices; photodiode array; sub-micron spatial resolution; thermal imaging camera; thermoreflectance; top metal contact layer; Cameras; Charge coupled devices; Charge-coupled image sensors; Optical imaging; Photodiodes; Semiconductor devices; Silicon germanium; Spatial resolution; Temperature sensors; Thermoreflectance imaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE

ISSN

1065-2221

Print_ISBN

0-7803-8363-X

Type

conf

DOI

10.1109/STHERM.2004.1291306

Filename

1320457