• DocumentCode
    3277188
  • Title

    A procedure to correct the error in the structure function based thermal measuring methods

  • Author

    Rencz, M. ; Poppe, A. ; Kollár, E. ; Ress, S. ; Székely, V. ; Courtois, B.

  • fYear
    2004
  • fDate
    9-11 Mar 2004
  • Firstpage
    92
  • Lastpage
    97
  • Abstract
    In this paper a methodology is presented to correct the systematic error of structure function based thermal material parameter measuring methods. This error stems from the fact that it is practically impossible to avoid parallel heat-flow paths in case of forced one-dimensional heat conduction. With the presented method we show how to subtract the effect of the parallel heat-flow paths from the measured structure function. With this correction methodology the systematic error of structure function based thermal material parameter measuring methods can be practically eliminated. Application examples demonstrate the accuracy increase obtained with the use of the method.
  • Keywords
    forced convection; thermal management (packaging); thermal resistance; transient response; error correction; forced one-dimensional heat conduction; parallel heat-flow paths; structure function based thermal measuring methods; Conducting materials; Conductivity measurement; Electrical resistance measurement; Error correction; Force measurement; Impedance measurement; Resistance heating; Thermal conductivity; Thermal resistance; Transient response;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-8363-X
  • Type

    conf

  • DOI
    10.1109/STHERM.2004.1291307
  • Filename
    1320458