Title :
3d-numerical Model Of BPSG Reflow Using Surface Diffusion
Author_Institution :
Mitsubishi Electric Corporation
fDate :
31 May-1 Jun 1992
Keywords :
Algorithm design and analysis; Chemicals; Circuit simulation; Glass; Laboratories; Large scale integration; Numerical models; Semiconductor device modeling; Surface tension; Surface topography;
Conference_Titel :
Numerical Modeling of Processes and Devices for Integrated Circuits, 1992. NUPAD IV. Workshop on
Print_ISBN :
0-7803-0516-7
DOI :
10.1109/NUPAD.1992.673840
