DocumentCode
3277257
Title
Packaging of a fiber optical MEMS switch
Author
Wang, Z.F. ; Cao, W. ; Arulvanan, P. ; Jin, Y.F. ; Pan, D.Y. ; Wang, Z.P.
Author_Institution
Singapore Inst. of Manuf. Technol., Singapore
fYear
2002
fDate
10-12 Dec. 2002
Firstpage
96
Lastpage
100
Abstract
In this paper, packaging of a Microelectromechanical System (MEMS)-based fiber optical switch was implemented along with the investigation on the related packaging techniques. A subpackage was formed as the first level encapsulation to house the MEMS chip. The results from fiber coupling test indicate a good alignment accuracy aided by the combination of rectangular shape fiber groove and fiber stopper. The packaging quality was evaluated through tensile test and cross section analysis.
Keywords
micro-optics; optical fibres; optical switches; packaging; cross-sectional analysis; encapsulation; fiber alignment; fiber coupling; fiber groove; fiber optical MEMS switch; fiber stopper; packaging; tensile test; Micromechanical devices; Mirrors; Optical devices; Optical fiber devices; Optical fiber testing; Optical fibers; Optical network units; Optical switches; Packaging; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2002. 4th
Print_ISBN
0-7803-7435-5
Type
conf
DOI
10.1109/EPTC.2002.1185605
Filename
1185605
Link To Document