Title :
Packaging of a fiber optical MEMS switch
Author :
Wang, Z.F. ; Cao, W. ; Arulvanan, P. ; Jin, Y.F. ; Pan, D.Y. ; Wang, Z.P.
Author_Institution :
Singapore Inst. of Manuf. Technol., Singapore
Abstract :
In this paper, packaging of a Microelectromechanical System (MEMS)-based fiber optical switch was implemented along with the investigation on the related packaging techniques. A subpackage was formed as the first level encapsulation to house the MEMS chip. The results from fiber coupling test indicate a good alignment accuracy aided by the combination of rectangular shape fiber groove and fiber stopper. The packaging quality was evaluated through tensile test and cross section analysis.
Keywords :
micro-optics; optical fibres; optical switches; packaging; cross-sectional analysis; encapsulation; fiber alignment; fiber coupling; fiber groove; fiber optical MEMS switch; fiber stopper; packaging; tensile test; Micromechanical devices; Mirrors; Optical devices; Optical fiber devices; Optical fiber testing; Optical fibers; Optical network units; Optical switches; Packaging; Wafer scale integration;
Conference_Titel :
Electronics Packaging Technology Conference, 2002. 4th
Print_ISBN :
0-7803-7435-5
DOI :
10.1109/EPTC.2002.1185605
