In-situ reliability analysis of solder joint by digital image correlation

Author

Pang, John H.L. ; Zhang, X.R. ; Liu, Q.J. ; Che, F.X. ; Low, T.H. ; Shi, X.Q. ; Wang, Z.P.

Author_Institution

Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore

fYear

2002

fDate

10-12 Dec. 2002

Firstpage

115

Lastpage

119

Abstract

A digital speckle image correlation system was developed to measure the in-situ micro-deformation of the solder joints in a flip chip on board (FCOB) assembly subject to thermal cycling. A pair of digital images acquired from an undeformed and deformed solder joint at certain temperature were correlated using a cross-search algorithm. As a result, deformation distributions in the solder joint were determined. Based on solder material´s viscoplastic and underfill material´s viscoelastic constitutive models, a finite element model was established to simulate the deformation of the assembly. The measurement results by correlation were then compared with the simulation results. It was found that U and V displacement fields of the solder joint obtained from the experiment and simulation are comparable.

Keywords

chip-on-board packaging; circuit reliability; correlation methods; finite element analysis; flip-chip devices; soldering; speckle; FCOB; cross-search algorithm; deformation distributions; deformed solder joint; digital image correlation; displacement fields; finite element model; in-situ micro-deformation; in-situ reliability analysis; solder joint; speckle image correlation system; thermal cycling; undeformed solder joint; viscoelastic constitutive models; viscoplastic models; Assembly systems; Deformable models; Digital images; Flip chip; Image analysis; Semiconductor device measurement; Soldering; Speckle; Temperature; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2002. 4th

Print_ISBN

0-7803-7435-5

Type

conf

DOI

10.1109/EPTC.2002.1185608

Filename

1185608