• DocumentCode
    3277350
  • Title

    Thermal optimization of electronic systems using Design of Experiments based on numerical inputs

  • Author

    Stewart, Thomas ; Stiver, David W.

  • Author_Institution
    Sun Microsystems, Newark, CA, USA
  • fYear
    2004
  • fDate
    9-11 Mar 2004
  • Firstpage
    135
  • Lastpage
    142
  • Abstract
    Design optimization of realistic electronic systems is often found to be prohibitive in today´s marketplace because of time constraints. Techniques, such as one-variable at a time (OFAT), that prove useful for simple designs, often fail for real-world applications. This paper describes a Design of Experiments (DoE) methodology used in conjunction with numerical inputs from a computational fluid dynamics (CFD) program to demonstrate an efficient method of optimization. As an example, the technique is used to optimize multiple aspects of the thermal performance of a next-generation network server. The outcome was that empirical prototype cycles were reduced from four to two and analytical experimentation cycles were dramatically reduced while producing a far more mature and viable cooling solution. Upon completion of the DoE, the only alterations to the design were the few minor adjustments and settings where the analytical models diverged from actual physical performance. These were rapidly finalized with the initial physical prototype, again using DoE techniques, and the final enclosure cooling architecture was completed.
  • Keywords
    semiconductor device models; semiconductor device testing; thermal management (packaging); Design of Experiments; computational fluid dynamics; electronic systems; empirical prototype cycles; next-generation network server; numerical inputs; thermal optimization; thermal performance; Analytical models; Computational fluid dynamics; Computer architecture; Constraint optimization; Design optimization; Electronics cooling; Heat sinks; Prototypes; Sun; Time factors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-8363-X
  • Type

    conf

  • DOI
    10.1109/STHERM.2004.1291315
  • Filename
    1320466