DocumentCode
3277445
Title
Characterization of airflow impedance in two types of telecommunications chassis
Author
Rhee, Jinny ; Wong, Gilbert
Author_Institution
San Jose State Univ., CA, USA
fYear
2004
fDate
9-11 Mar 2004
Firstpage
161
Lastpage
167
Abstract
The airflow impedance curve for two common configurations used in telecommunications chassis were measured and examined in non-dimensional coordinates, such that data obtained at sea level may be scaled to increased altitudes. The results show that the non-dimensional airflow impedance curves for both chassis configurations predict minimal changes in air velocity with increased altitude for most of the Reynolds number ranges studied. However, for one chassis configuration studied, a slight decrease in air velocity is predicted with increased altitude. Because a nonconservative component temperature predictions at high altitude will result if constant air velocity is assumed, the decrease in air velocity should be accounted for if there are critical electronic components operating near their maximum temperatures. Reliable operation of electronic components in telecommunications equipment up to 4000 m (13,000 ft.) is a requirement of the Network Equipment and Building Standard (NEBS).
Keywords
atmospheric turbulence; heat transfer; telecommunication equipment; thermal management (packaging); Reynolds number; airflow impedance curve; increased altitude; nondimensional coordinates; telecommunications chassis; Coordinate measuring machines; Electrical resistance measurement; Electronic components; Electronics cooling; Fans; Impedance measurement; Ocean temperature; Sea level; Sea measurements; Telecommunication standards;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE
ISSN
1065-2221
Print_ISBN
0-7803-8363-X
Type
conf
DOI
10.1109/STHERM.2004.1291319
Filename
1320470
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