Superlattice microrefrigerators flip-chip bonded with optoelectronic devices

A 3D electrothermal model was developed to study the InP-based thin film In_0.53Ga_0.47As/In_0.52Al_0.48As superlattice microrefrigerators for various device sizes, ranging from 40×40μm² to 120×120μm². We discussed maximum cooling and cooling power densities for current devices, analyzed the non-idealities of current devices and proposed an optimized structure. The simulation results demonstrated a maximum cooling of 30°C with cooling power density over 300 W/cm² with an optimized structure based on the current device geometry. Furthermore, we also demonstrated that a maximum cooling, over 10°C with power density over 900 W/cm², could be possible when the current figure of merit of InGaAs/InAlAs superlattice is enhanced five times with the non-conserved lateral momentum. Besides monolithic integration, we also propose a flip-chip bonded solution to integrate these microrefrigerator with the optoelectronic chips. Preliminary 3D electrothermal simulation will be present to analyze its cooling effects for this 2-chip integration model.