Title :
Research on a micro-channel heat exchanging system based on thermoelectric control
Author :
Jia, J.Y. ; Wang, W.D. ; Wang, H.X. ; Fan, K.Q.
Author_Institution :
Sch. of Electro-Mech. Eng., Xidian Univ., Xi´´an, China
Abstract :
A micro-channel heat exchanging system is developed for the thermal management of high-density electronic packages in the atrocious high-low temperature environment. Being a closed-loop system, it mainly consists of two micro-channel heat exchangers, a micro-pump, a few pipes, a thermoelectric module, some temperature sensors and an active controller. On the basis of the classical heat transfer theory and its correlations, a nonlinear analytical model is established for the system and a numerical simulation is preceded for a set of experimental equipment. Active control, based on the best performance coefficient of TEM, is utilized for the system. Some experiments are carried out with a set of experimental equipment in high-low temperature circumstances. The simulation results are well in accordance with the test results, on condition that the chip works at 18 to 50 with surrounding temperature ranged from -40 to 50. The research shows that the theoretical model correctly reflects the physical properties of the experimental equipment, and the model can be used to design thermal control systems for electronic chips in ugly temperature surroundings.
Keywords :
cooling; heat transfer; microfluidics; micropumps; thermal management (packaging); thermoelectric conversion; TEM; active controller; closed-loop system; high-density electronic packages; high-low temperature environment; micro-channel heat exchanging system; micro-pump; pipes; temperature sensors; thermoelectric control; Control systems; Electronic packaging thermal management; Environmental management; Heat transfer; Micropumps; Temperature control; Temperature sensors; Thermal management; Thermal management of electronics; Thermoelectricity;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE
Print_ISBN :
0-7803-8363-X
DOI :
10.1109/STHERM.2004.1291328