DocumentCode :
3277702
Title :
A "Water Shell" Model for the Dielectric Properties of Hydrated Silica-filled Epoxy Nano-composites
Author :
Zou, C. ; Fothergill, J.C. ; Rowe, S.W.
Author_Institution :
Eng. Dept., Univ. of Leicester, Leicester
fYear :
2007
fDate :
8-13 July 2007
Firstpage :
389
Lastpage :
392
Abstract :
The dielectric properties of epoxy resin have been studied as a function of hydration. The epoxy was studied in an un-filled state, filled with 40 mum SiO2 particles, and filled with 50 nm SiO2 particles. The relative humidity was controlled by saturated salt solutions at ambient temperatures from 298 -353 K. Measurements were made using dielectric spectroscopy over the frequency range 10-3 - 105 Hz. The hydration isotherm (i.e. the mass uptake of water) was established by measuring the mass as a function of relative humidity (RH). It was found that the nanocomposites absorb up to 60% more water than the unfilled and micro-filled epoxies. Dielectric spectroscopy shows different conduction and quasi- DC behaviours at very low frequencies (<10-2 Hz) with activation energies dependent on the hydration and temperature. These observations have led to the development of a "water shell" model.
Keywords :
composite insulating materials; dielectric materials; filled polymers; glass transition; humidity; nanocomposites; silicon compounds; solvation; activation energies; dielectric properties; dielectric spectroscopy; epoxy resin; hydration; nanocomposites; relative humidity; silica-filled epoxy nanocomposites; size 40 mum; size 50 nm; solid electrical insulation; temperature 298 K to 353 K; water shell model; Dielectric measurements; Electrochemical impedance spectroscopy; Epoxy resins; Frequency measurement; Humidity control; Humidity measurement; Temperature control; Temperature distribution; Water; Weight control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid Dielectrics, 2007. ICSD '07. IEEE International Conference on
Conference_Location :
Winchester
Print_ISBN :
1-4244-0750-8
Electronic_ISBN :
1-4244-0751-6
Type :
conf
DOI :
10.1109/ICSD.2007.4290834
Filename :
4290834
Link To Document :
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