Title :
Thermal interaction of an array of flip chip components
Author :
Joiner, Bennett ; De Oca, Tony Montes
Author_Institution :
Motorola Inc., Austin, TX, USA
Abstract :
Thermal interactions for an array of FC-CBGA components were examined with both simulation and measurement. The effective thermal resistance of the component can easily double depending on the density of the surrounding components. The increase in thermal resistance is significantly greater than has been reported by other recent studies using leaded components.
Keywords :
cooling; flip-chip devices; heat transfer; thermal management (packaging); thermal resistance; FC-CBGA components; effective thermal resistance; flip chip components; thermal interactions; Ceramics; Computational fluid dynamics; Copper; Electrical resistance measurement; Flip chip; Packaging; Printed circuits; Temperature measurement; Thermal conductivity; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE
Print_ISBN :
0-7803-8363-X
DOI :
10.1109/STHERM.2004.1291336
