Title :
High throughput architecture for CLICHÉ Network on Chip
Author :
El Ghany, Mohamed A Abd ; El-Moursy, Magdy A. ; Ismail, Mohammed
Author_Institution :
Electron. Eng. Dept., German Univ. in Cairo, Cairo, Egypt
Abstract :
High throughput chip-level integration of communicating heterogeneous elements (CLICHE) architecture to achieve high performance networks on chip (NoC) is proposed. The architecture increases the throughput of the network by 40% while preserving the average latency. The area of high throughput CLICHE¿ switch is decreased by 18% as compared to CLICHE¿ switch. The total metal resources required to implement high throughput CLICHE¿ design is increased by 7% as compared to the total metal resources required to implement CLICHE¿ design. The extra power consumption required to achieve the proposed architecture is 8% of the total power consumption of the CLICHE¿ architecture.
Keywords :
computer architecture; network-on-chip; switches; CLICHE network on chip; communicating heterogeneous elements; high throughput CLICHE¿ switch; high throughput architecture; high throughput chip-level integration; power consumption; total metal resources; Decoding; Delay; Energy consumption; Frequency; Graphics; Integrated circuit interconnections; Multiplexing; Network-on-a-chip; Switches; Throughput; CLICHÉ; Latency; NoC; Throughput;
Conference_Titel :
SOC Conference, 2009. SOCC 2009. IEEE International
Conference_Location :
Belfast
Print_ISBN :
978-1-4244-4940-8
Electronic_ISBN :
978-1-4244-4941-5
DOI :
10.1109/SOCCON.2009.5398069
