DocumentCode
3277796
Title
DC Breakdown in Polyetherimide Composites and Implication for Structural Engineering
Author
Tan, Qi ; Cao, Yang ; Irwin, Patricia
Author_Institution
One Res. Circle, GE Global Res., Niskayuna, NY
fYear
2007
fDate
8-13 July 2007
Firstpage
411
Lastpage
414
Abstract
Recent advances in nanomaterials permit the improvement of dielectric characteristics of ceramic / polymers nanocomposites. In addition, it is recognized that incorporation of nanofillers improves the mechanical, chemical, optical, acoustic, and thermal properties of polymers. Voltage endurance and electrical breakdown strength of dielectrics were even enhanced with some nanometric particles. Nevertheless, the preferred filler type and consistent improvement in the breakdown strength in the resulting nanocomposites are not well understood. In this paper, the effect of various fillers (metal, semiconductor and insulator) was studied showing the weak relationship of breakdown strength with the band gap of the nanoceramic fillers. Published data on dielectric constant and breakdown strength of various dielectrics was analyzed from the viewpoint of energy band gap. The results show that interfacial interaction of the ceramic particle-polymer appears to be very important to the electrical breakdown of the nanocomposites. An engineered nanodielectric structure is proposed for higher permittivity and dielectric breakdown strength. Lacking of control of this interface and structural order at mesoscopic level is subjected to fundamental limitations of the nanodielectric engineering.
Keywords
ceramics; composite insulating materials; electric breakdown; energy gap; filled polymers; permittivity; DC breakdown; band gap; breakdown strength; ceramic particle-polymer interfacial interaction; dielectric constant; insulator fillers; metal fillers; nanoceramic fillers; permittivity; polyetherimide composites; semiconductor fillers; Breakdown voltage; Ceramics; Chemicals; Dielectric breakdown; Electric breakdown; Nanocomposites; Nanomaterials; Optical polymers; Photonic band gap; Structural engineering;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid Dielectrics, 2007. ICSD '07. IEEE International Conference on
Conference_Location
Winchester
Print_ISBN
1-4244-0750-8
Electronic_ISBN
1-4244-0751-6
Type
conf
DOI
10.1109/ICSD.2007.4290839
Filename
4290839
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