Title :
Effects of on-package decoupling on microprocessor power delivery design
Author :
Huang, Liwen ; Weiss, Daniel ; Rausch, M.
Author_Institution :
Platform Archit. Lab., Intel Corp.
Abstract :
On-package decoupling is evaluated for microprocessor power delivery on package and on core. Full-chip system modeling mechanics are introduced. On-die noise sensitivity to parameters associated with package design is analyzed
Keywords :
integrated circuit modelling; integrated circuit noise; integrated circuit packaging; microprocessor chips; sensitivity analysis; full-chip system modeling; microprocessor power delivery design; on-die noise sensitivity; on-package decoupling; package design; power network; power supply noise;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564790
