Title :
A. quad 2.7 Gb/s parallel optical transceiver
Author :
Ahadian, J. ; Englekirk, M. ; Wong, M. ; Li, T. ; Hagan, R. ; Pommer, R. ; Kuznia, C.
Author_Institution :
Peregrine Semicond., San Diego, CA, USA
Abstract :
The realization of short-reach parallel optical interconnects based on multi-mode fiber ribbons requires the coalescence of vertical-cavity surface-emitting lasers, photodetectors, transmit and receiver circuitry, and an optical power control system within a compact assembly. This paper describes a solution based on silicon-on-sapphire IC technology and demonstrates an optical transceiver featuring four transmitters and four receivers, each operating at up to 2.7 Gb/s. Flip-chip bonding is used to attach four-element laser and photodetector die to the IC. Optical signals propagate through the transparent sapphire substrate. Lateral photodiodes implemented in the IC process are used to monitor the optical output power, and embedded controllers have been developed to regulate this power on a per-channel basis. Key circuit designs are presented, following a summary of the optoelectronic chip-scale packaging technology.
Keywords :
chip scale packaging; flip-chip devices; integrated optoelectronics; optical interconnections; optical receivers; optical transmitters; photodiodes; silicon-on-insulator; surface emitting lasers; 2.7 Gbit/s; Si-Al2O3; flip-chip bonding; integrated optoelectronics; multimode fiber ribbons; optical power control system; optoelectronic chip-scale packaging; photodetectors; photodiodes; quad parallel optical transceiver; short-reach parallel optical interconnects; silicon on insulator technology; silicon-on-sapphire IC technology; vertical-cavity surface-emitting lasers; Fiber lasers; Optical control; Optical interconnections; Optical receivers; Optical transmitters; Photodetectors; Photonic integrated circuits; Surface emitting lasers; Transceivers; Vertical cavity surface emitting lasers;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2004. Digest of Papers. 2004 IEEE
Print_ISBN :
0-7803-8333-8
DOI :
10.1109/RFIC.2004.1320511