DocumentCode
3278259
Title
Reduction of power and ground noise coupling in mixed signal modules
Author
Jiayuan Fang ; Zhaoqing Chen ; Yuzhe Chen
Author_Institution
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY
fYear
1996
fDate
28-30 Oct 1996
Firstpage
90
Lastpage
92
Abstract
By the full-wave electromagnetic field simulation, the effectiveness of certain measures to reduce the power and ground noise coupling in mixed signal modules is investigated. Segmentation of power and ground planes and proper placement of decoupling capacitors for the reduction of noise coupling are evaluated
Keywords
circuit noise; electromagnetic interference; interference suppression; modules; packaging; transient analysis; EMI; decoupling capacitor placement; full-wave EM field simulation; ground noise coupling; mixed signal modules; noise coupling reduction; power noise coupling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location
Napa, CA
Print_ISBN
0-7803-3514-7
Type
conf
DOI
10.1109/EPEP.1996.564791
Filename
564791
Link To Document