Title :
Reduction of power and ground noise coupling in mixed signal modules
Author :
Jiayuan Fang ; Zhaoqing Chen ; Yuzhe Chen
Author_Institution :
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY
Abstract :
By the full-wave electromagnetic field simulation, the effectiveness of certain measures to reduce the power and ground noise coupling in mixed signal modules is investigated. Segmentation of power and ground planes and proper placement of decoupling capacitors for the reduction of noise coupling are evaluated
Keywords :
circuit noise; electromagnetic interference; interference suppression; modules; packaging; transient analysis; EMI; decoupling capacitor placement; full-wave EM field simulation; ground noise coupling; mixed signal modules; noise coupling reduction; power noise coupling;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564791
