A novel twisted differential line for high-speed on-chip interconnections with reduced crosstalk

Differential signaling has become a popular choice for high-speed interconnection schemes, offering superior immunity to external noise. However, conventional differential transmission lines still have problems, such as crosstalk and radiated emission. To overcome these, we propose a twisted differential line (TDL) structure. In this paper, experimental results of the proposed structure on a multi-layer PCB are summarized. Its improved immunity to crosstalk, and the reduced radiated emission have been successfully demonstrated. Furthermore, the TDL is firstly implemented on a chip and the preliminary results are reported. Finally, it is demonstrated that the proposed TDL delivers a promising solution for high-speed and high-density digital interconnection designs.