A novel twisted differential line for high-speed on-chip interconnections with reduced crosstalk

Author

Kam, Dong Gun ; Ahn, Seungyoung ; Baek, Seungyong ; Park, Bongcheol ; Sung, Myunghee ; Kim, Joungho

Author_Institution

Dept. of EECS, KAIST, Daejeon, South Korea

fYear

2002

fDate

10-12 Dec. 2002

Firstpage

180

Lastpage

183

Abstract

Differential signaling has become a popular choice for high-speed interconnection schemes, offering superior immunity to external noise. However, conventional differential transmission lines still have problems, such as crosstalk and radiated emission. To overcome these, we propose a twisted differential line (TDL) structure. In this paper, experimental results of the proposed structure on a multi-layer PCB are summarized. Its improved immunity to crosstalk, and the reduced radiated emission have been successfully demonstrated. Furthermore, the TDL is firstly implemented on a chip and the preliminary results are reported. Finally, it is demonstrated that the proposed TDL delivers a promising solution for high-speed and high-density digital interconnection designs.

Keywords

circuit noise; crosstalk; integrated circuit interconnections; packaging; printed circuit design; TDL; crosstalk; differential signaling; external noise; high-density digital interconnection designs; high-speed on-chip interconnections; multi-layer PCB; radiated emission; twisted differential line; Crosstalk; Distortion; Laboratories; Logic; Noise reduction; Packaging; Signal processing; Strips; Transmission lines; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2002. 4th

Print_ISBN

0-7803-7435-5

Type

conf

DOI

10.1109/EPTC.2002.1185664

Filename

1185664