Impact of meshed ground planes on broadband performance of LTCC

Author

Lu, Albert Chee W ; Fan, Wei ; Wai, Lai L. ; Jin, Lin

Author_Institution

Singapore Inst. of Manuf. Technol., Singapore

fYear

2002

fDate

10-12 Dec. 2002

Firstpage

245

Lastpage

248

Abstract

Coupling between interconnects in high density structures limits the broadband performance, leading to degradation in insertion loss and crosstalk characteristics. This paper describes the solution space analysis of LTCC interconnects with meshed planes. The impact of mesh size, signal pitch and mesh pitch was evaluated through detailed 3-D FEM based simulations.

Keywords

ceramic packaging; crosstalk; losses; mesh generation; 3D FEM based simulations; LTCC; broadband performance; crosstalk characteristics; degradation; high density structures; insertion loss; mesh pitch; meshed ground planes; meshed planes; signal pitch; solution space analysis; Crosstalk; Degradation; Dielectric losses; Frequency dependence; Insertion loss; Manufacturing; Measurement; Performance analysis; Performance loss; Space technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2002. 4th

Print_ISBN

0-7803-7435-5

Type

conf

DOI

10.1109/EPTC.2002.1185675

Filename

1185675

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3278868