Title :
Impact of meshed ground planes on broadband performance of LTCC
Author :
Lu, Albert Chee W ; Fan, Wei ; Wai, Lai L. ; Jin, Lin
Author_Institution :
Singapore Inst. of Manuf. Technol., Singapore
Abstract :
Coupling between interconnects in high density structures limits the broadband performance, leading to degradation in insertion loss and crosstalk characteristics. This paper describes the solution space analysis of LTCC interconnects with meshed planes. The impact of mesh size, signal pitch and mesh pitch was evaluated through detailed 3-D FEM based simulations.
Keywords :
ceramic packaging; crosstalk; losses; mesh generation; 3D FEM based simulations; LTCC; broadband performance; crosstalk characteristics; degradation; high density structures; insertion loss; mesh pitch; meshed ground planes; meshed planes; signal pitch; solution space analysis; Crosstalk; Degradation; Dielectric losses; Frequency dependence; Insertion loss; Manufacturing; Measurement; Performance analysis; Performance loss; Space technology;
Conference_Titel :
Electronics Packaging Technology Conference, 2002. 4th
Print_ISBN :
0-7803-7435-5
DOI :
10.1109/EPTC.2002.1185675
