DocumentCode
3278923
Title
Attenuation in ribbon microstrip with and without dielectric cover
Author
Joshi, K.K. ; Pollard, R.D. ; Postoyalko, V.
Author_Institution
Dept. of Eletron. Sci., SP Coll., Pune
fYear
1996
fDate
28-30 Oct 1996
Firstpage
97
Lastpage
99
Abstract
Losses in a microstrip on polyimide with finite metal thickness with and without dielectric cover has been modelled using variational analysis in the FTD and the data has been compared with the measurements on crosstalk
Keywords
dielectric losses; integrated circuit interconnections; losses; microstrip lines; multichip modules; packaging; polymer films; variational techniques; waveguide theory; FTD; MCM-D; attenuation; conductor losses; crosstalk measurements; dielectric cover; dielectric loss; finite metal thickness; microstrip interconnects; polyimide; ribbon microstrip; variational analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location
Napa, CA
Print_ISBN
0-7803-3514-7
Type
conf
DOI
10.1109/EPEP.1996.564794
Filename
564794
Link To Document