Title :
Time domain simulation of power electronics circuits using embedded companion models
Author :
Chung, Henry Shu-Hung ; Hui, S.Y.R. ; Mak, K.Y.
Author_Institution :
Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong
Abstract :
This paper presents a stepwise time-domain simulation technique for analysis of power electronics circuits. New companion models embedding with parasitic resistance of reactive elements and switches are proposed. In every simulation step, a switching circuit is transformed into a resistive network, which is analyzed by a modified nodal approach. The switch model enables a switching circuit to be modeled by a constant system matrix, regardless of the switching state. This feature allows a circuit with numerous topologies to be modeled elegantly by one set of algebraic equation, and a reduction of circuit formulation and computation time. By using quadratic extrapolation on circuit waveforms within a simulation step, a simple and direct method is used to determine switching instants. Simulated results are verified with experimental measurements
Keywords :
DC-DC power convertors; circuit simulation; electric resistance; network analysis; power electronics; switching circuits; time-domain analysis; DC-DC power converters; algebraic equation; buck regulator; circuit formulation; circuit waveforms; constant system matrix; embedded companion models; modified nodal approach; parasitic resistance; power electronics circuits; quadratic extrapolation; reactive elements; resistive network; simulation step; stepwise time-domain simulation; switch model; switches; switching circuit; switching instants; switching state; Analytical models; Circuit simulation; Circuit topology; Computational modeling; Network topology; Power electronics; Power system modeling; Switches; Switching circuits; Time domain analysis;
Conference_Titel :
Industrial Electronics, 1999. ISIE '99. Proceedings of the IEEE International Symposium on
Conference_Location :
Bled
Print_ISBN :
0-7803-5662-4
DOI :
10.1109/ISIE.1999.801789