DocumentCode :
3279080
Title :
Transient thermal analysis applied to an IC package
Author :
Mandal, Rathin ; Baomin, Liu ; Mui, Y.C.
Author_Institution :
Adv. Micro Devices (S) Pvt. Ltd., Singapore, Singapore
fYear :
2002
fDate :
10-12 Dec. 2002
Firstpage :
289
Lastpage :
292
Abstract :
A transient thermal study was performed by experiment and CFD (Computational Fluid Dynamics) simulation on an IC (Integrated Circuit) package to predict real time thermal responses. The experiment was conducted using a JEDEC standard 2s2p test board and a thermal test die in a closed loop wind tunnel. The transient thermal behavior of the IC package was captured with a LabView program and a data acquisition system. A three-dimensional half model was developed with Flotherm3.2 CFD software and solved for the same boundary conditions of the experiment. Detailed geometrical models of die, underfill, bumps, substrate, socket, pins and PCB were simulated as solid cuboids. The model was validated and achieved a 92% agreement with experimental results. The simulation model was further used to predict the thermal response subject to various boundary conditions such as application of burst power and with a heat sink. The validated methodology was then applied to a live organic pin grid array package (OPGA) and its transient characteristics were determined for computer cold start process. An agreement of 90% was achieved between the numerical result and experiment data.
Keywords :
computational fluid dynamics; heat sinks; integrated circuit packaging; thermal analysis; thermal management (packaging); transient analysis; Flotherm3.2 software; LabView program; boundary condition; burst power; computational fluid dynamics; computer cold start process; data acquisition system; heat sink; integrated circuit package; organic pin grid array package; real-time thermal response; simulation model; thermal testing; three-dimensional half model; transient thermal analysis; Boundary conditions; Circuit testing; Computational fluid dynamics; Computational modeling; Integrated circuit modeling; Integrated circuit packaging; Power system modeling; Predictive models; Solid modeling; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2002. 4th
Print_ISBN :
0-7803-7435-5
Type :
conf
DOI :
10.1109/EPTC.2002.1185685
Filename :
1185685
Link To Document :
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