Title :
An algorithm for the direct co-simulation of dynamic compact models of packages with the detailed thermal models of boards
Author :
Rencz, M. ; Szekely, V. ; Poppe, A. ; Courtois, B.
Author_Institution :
MicReD Ltd., Budapest, Hungary
Abstract :
The paper presents an algorithm for the co-simulation of packages given with RC compact models and printed circuit boards. This enables on one hand the correct detailed consideration of the heat transfer in the board, on the other hand the calculation of the exact junction temperatures within the packages. Considering individual heat transfer coefficients for each package, or even to each side of the packages is possible. The main advantage is that the methodology keeps the fastness and user friendliness of the board level solvers, while giving information also about the details of the temperatures within or at the surfaces of the packages.
Keywords :
circuit simulation; heat transfer; integrated circuit modelling; integrated circuit packaging; printed circuit design; thermal analysis; thermal management (packaging); board heat transfer; board level solvers; detailed board thermal models; dynamic IC compact models; heat transfer coefficients; package compact models; package junction temperature; package surface temperature; package/PCB co-simulation; Frequency domain analysis; Heat sinks; Heat transfer; Human computer interaction; Integrated circuit modeling; Laboratories; Packaging; Printed circuits; Steady-state; Temperature;
Conference_Titel :
Electronics Packaging Technology Conference, 2002. 4th
Print_ISBN :
0-7803-7435-5
DOI :
10.1109/EPTC.2002.1185686
