Title :
Fatigue analysis of out-of-plane vibration polysilicon cantilever beam under high-cycle vibration loads
Author :
Chen, Long-long ; Song, Jing ; Huang, Qing-An ; Tang, Jie-ying
Author_Institution :
Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China
Abstract :
It has been proved that polysilicon film will fatigue under high cycle mechanical loads. However, there are still debates on its fatigue mechanism. In this paper, a different configuration is applied to the fatigue test to discover more phenomena. The test structure is a surface-micromachined microcantilever that vibrates out of plane under electrostatic excitation at its resonant frequency. A U-shaped notch is reaction-ion-etched at the root of the structure to induce stress concentration. Fatigue behavior is monitored by recording the shift of the resonant frequency using a laser Doppler vibrometer. Results show that the relative frequency shift reaches up to 1.3%. Compared with the reported data, the concentrated stress (about 1-10 MPa) is two orders of magnitude smaller, and the shift is two orders larger, indicating a very rapid fatigue procedure. This may be due to the greater roughness of the notch surface induced by the RIE process. The details of the mechanism are still under exploration.
Keywords :
cantilevers; fatigue; fatigue testing; micromachining; microsensors; sputter etching; vibration measurement; vibrations; U-shaped notch; electrostatic excitation; fatigue analysis; high cycle mechanical loads; laser Doppler vibrometer; out-of-plane vibration; polysilicon cantilever beam; polysilicon film; reaction-ion-etching; surface-micromachined microcantilever; Electrostatics; Fatigue; Laser excitation; Monitoring; Resonant frequency; Stress; Structural beams; Testing; Vibrations; Vibrometers;
Conference_Titel :
Sensors, 2009 IEEE
Conference_Location :
Christchurch
Print_ISBN :
978-1-4244-4548-6
Electronic_ISBN :
1930-0395
DOI :
10.1109/ICSENS.2009.5398144