Optimization of thermal management techniques for low cost optoelectronic packages

Optical characteristics and reliability of optical transmitter packages have a large dependence on junction temperature of laser diode (LD). A thermoelectric cooler (TEC) is commonly used to cool and maintain LD junction at predetermined temperature. The current research aims to develop a low cost optical transmitter with an uncooled LD. The thermal performance of the junction down LD has been investigated. By optimizing the interconnection between the junction-down (j-down) LD and the carrier, the thermal resistance from heat source to sub mount bottom was minimized. The thermal design guideline of j-down LD is proposed in this paper.