Title :
Time and temperature dependent mechanical characterization of polyimide materials in electronic packaging application
Author :
Kuo, Chia-Tai ; Yip, Ming-Chuen ; Chiang, Kuo-Ning
Author_Institution :
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
The thermo-mechanical testing of high performance polyimide films Type HPP-ST supplied by Dupont® is preceded under different strain rate and temperature environment. The stress-strain behavior of materials is simulated with constitutive framework, and the dependence of Young´s modulus on temperature and strain rate is reported . In view of the uncertainty of the Young´s module determination, the specimens were tested with unloading-reloading to verify the test results. Constant strain rate uniaxial tensile test and long-term creep test at various temperatures are preceded to characterize the time-temperature-dependent mechanical property precisely. Cyclic loading test was also performed on the specimen to investigate cyclic stress-strain behaviors. There is no research definitely related in the past, therefore the research is expected to enhance the finite-element-modeling accuracy and characterize the material properties preciously.
Keywords :
Young´s modulus; creep; finite element analysis; packaging; polymer films; stress-strain relations; Type HPP-ST; Young´s modulus; constitutive model; creep test; cyclic loading; electronic packaging; finite element model; mechanical characteristics; polyimide film; strain rate dependence; stress-strain relation; temperature dependence; thermomechanical testing; time dependence; uniaxial tensile test; Capacitive sensors; Creep; Electronics packaging; Polyimides; Temperature dependence; Tensile strain; Testing; Thermomechanical processes; Uncertainty; Uniaxial strain;
Conference_Titel :
Electronics Packaging Technology Conference, 2002. 4th
Print_ISBN :
0-7803-7435-5
DOI :
10.1109/EPTC.2002.1185708