Title :
CAD models of a QFP-24 pin package for radiofrequency applications
Author :
Ndagijimana, F. ; Chilo, Jose
Author_Institution :
UMR, LEMO-ENSERG, Grenoble
Abstract :
CAD models of the QFP-24 package are presented for high speed logic applications up to 1 Gbit/s and for radiofrequency applications up to 3 GHz. From geometrical parameters of the package, electromagnetic simulations are performed using an integral equations technique and lumped L-C elements are calculated, including inductive and capacitive coupling effect. Dynamic performances of an assembly including the QFP-24 package and a high speed switch are simulated; typical results for insertion losses and isolation losses are discussed as functions of connection paths to ground
Keywords :
CAD; UHF integrated circuits; electronic engineering computing; equivalent circuits; integral equations; integrated circuit modelling; integrated circuit packaging; integrated logic circuits; losses; 1 Gbit/s; 3 GHz; CAD models; QFP-24 pin package; RF applications; capacitive coupling effect; dynamic performances; electromagnetic simulations; geometrical parameters; high speed logic applications; high speed switch; inductive coupling effect; insertion losses; isolation losses; lumped L-C elements; quad flat pack; radiofrequency applications;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564797
