CAD models of a QFP-24 pin package for radiofrequency applications

Author

Ndagijimana, F. ; Chilo, Jose

Author_Institution

UMR, LEMO-ENSERG, Grenoble

fYear

1996

fDate

28-30 Oct 1996

Firstpage

103

Lastpage

105

Abstract

CAD models of the QFP-24 package are presented for high speed logic applications up to 1 Gbit/s and for radiofrequency applications up to 3 GHz. From geometrical parameters of the package, electromagnetic simulations are performed using an integral equations technique and lumped L-C elements are calculated, including inductive and capacitive coupling effect. Dynamic performances of an assembly including the QFP-24 package and a high speed switch are simulated; typical results for insertion losses and isolation losses are discussed as functions of connection paths to ground

Keywords

CAD; UHF integrated circuits; electronic engineering computing; equivalent circuits; integral equations; integrated circuit modelling; integrated circuit packaging; integrated logic circuits; losses; 1 Gbit/s; 3 GHz; CAD models; QFP-24 pin package; RF applications; capacitive coupling effect; dynamic performances; electromagnetic simulations; geometrical parameters; high speed logic applications; high speed switch; inductive coupling effect; insertion losses; isolation losses; lumped L-C elements; quad flat pack; radiofrequency applications;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting

Conference_Location

Napa, CA

Print_ISBN

0-7803-3514-7

Type

conf

DOI

10.1109/EPEP.1996.564797

Filename

564797