Packaging processes using flip chip bonder and future directions of technology development

We brought the COG (chip on glass) bonder for LCD application to market in 1988. Since then, we have been successfully developing various types of flip chip bonders to meet a variety of market needs and product applications. In addition to the COG bonder, we are currently working on a wide range of bonders, including bonders for COF (chip on flexible printed circuit) packaging using flexible substrates, DCA packaging using C4 technology, optoelectronics-related laser diode packaging, and MEMS-related packaging. This presentation focuses on the four popular flip-chip packaging processes: 1) the Au-Sn process, 2) the ACF/ACP (anisotropic conductive adhesive film) process, 3) the NCP (non-conductive resin paste) process, and 4) the solder process, with emphasis upon the key technology in each process mechanism. The bonding equipment available for each product application is described in detail. In the future, company efforts will be directed toward the development of equipment and processes that can meet the growing market demand for more compact packages and the narrower bump pitch and multi-bump features on IC chips that accompany greater functionality. To respond to this demand, we are bringing ultrasonic bonding technology to the market. This report presents an overview of the key technologies and equipment, including the latest trends.