• DocumentCode
    3279676
  • Title

    Use of simulation to improve the kitting process at an EMS provider´s facility

  • Author

    Joshi, Abhijit ; Phadnis, Sachin S. ; Srihari, K. ; Seeniraj, Ramprasad

  • Author_Institution
    Electron. Manuf. Res. & Services, State Univ. of New York, Binghamton, NY, USA
  • fYear
    2002
  • fDate
    10-12 Dec. 2002
  • Firstpage
    440
  • Lastpage
    445
  • Abstract
    In an electronics manufacturing service (EMS) provider´s environment, smooth and continuous manufacturing flow is extremely desirable. The kitting stage is of critical importance in a streamlined surface mount technology (SMT) assembly process. Based on historical data, the kitting process at the EMS provider where this research was conducted was identified as a focus for continuous improvement. This paper discusses the research undertaken to improve the kitting process at a medium volume, medium to high mix EMS provider´s environment. The process improvement effort was based on a six-sigma approach with simulation being used as an analysis tool. At present, three of the five phases of the six-sigma approach have been completed with encouraging positive results. This paper discusses problems at the kitting stage of a printed circuit board (PCB) assembly process and the use of simulation to improve the process by reducing discrepancies.
  • Keywords
    assembling; printed circuit manufacture; process control; quality control; surface mount technology; EMS provider kitting process; PCB assembly process; SMT assembly process; continuous improvement; discrepancy reduction; electronics manufacturing service provider; medium volume EMS; medium/high mix EMS; printed circuit board assembly; process improvement; six-sigma approach; surface mount technology; Analytical models; Assembly; Circuit simulation; Continuous improvement; Electronic equipment manufacture; Manufacturing processes; Medical services; Printed circuits; Production facilities; Surface-mount technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2002. 4th
  • Print_ISBN
    0-7803-7435-5
  • Type

    conf

  • DOI
    10.1109/EPTC.2002.1185712
  • Filename
    1185712