Title :
A diplexer-matching dual-band power amplifier LTCC module for IEEE 802.11a/b/g wireless LANs
Author :
Kunihiro, Kazuaki ; Yamanouchi, S. ; Miyazaki, Takashi ; Aoki, Yuuichi ; Ikuina, K. ; Ohtsuka, Takashi ; Hida, Hirotaka
Author_Institution :
Syst. Devices Res. Labs., NEC Corp., Ibaraki, Japan
Abstract :
We have developed a compact dual-band (2.4/5 GHz) power-amplifier module with a concurrent two-stage InGaP/GaAs HBT for triple-mode (IEEE 802.11a/b/g) WLANs. The proposed diplexer-matching network is three-dimensionally implemented in an LTCC substrate (5×5 mm). The module exhibits an output power of 20 dBm at 2.4 GHz, and 18 dBm at 5.25 GHz with an error vector magnitude of 4-5% for a 54-Mbps OFDM signal. Our approach of using a concurrent dual-band PA reduces the size and cost by almost half compared with using a conventional parallel PA.
Keywords :
OFDM modulation; UHF power amplifiers; ceramic packaging; heterojunction bipolar transistors; impedance matching; microwave power amplifiers; modules; multiplexing equipment; wireless LAN; 2.4 GHz; 5 mm; 5.25 GHz; 54 Mbit/s; IEEE 802.11a/b/g; InGaP-GaAs; LTCC module; LTCC substrate; OFDM signal; concurrent dual-band PA; concurrent two-stage HBT; diplexer-matching network; dual-band power amplifier; error vector magnitude; impedance matching; triple-mode WLAN; wireless LAN; Costs; Dual band; Impedance matching; Local area networks; National electric code; OFDM; Power amplifiers; Power generation; Radiofrequency amplifiers; Wireless LAN;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2004. Digest of Papers. 2004 IEEE
Print_ISBN :
0-7803-8333-8
DOI :
10.1109/RFIC.2004.1320603
