Title :
Endpoint detection using optical emission spectroscopy in TSV fabrication
Author :
Ja Myung Gu ; Thadesar, Paragkumar A. ; Dembla, Ashish ; Sang Jeen Hong ; Bakir, Muhannad S. ; May, Gary S.
Author_Institution :
Dept. of Electron. Eng., Myongji Univ., Yongin, South Korea
Abstract :
A hybrid partial least squares-support vector machine (PLS-SVM) model of optical emission spectroscopy data is proposed and successfully demonstrated to predict the endpoint detection of through silicon vias (TSVs) etched using the Bosch process. Accurate results are shown for TSVs with diameters of 80 μm and 25 μm.
Keywords :
etching; least squares approximations; support vector machines; three-dimensional integrated circuits; Bosch process; TSV fabrication; endpoint detection; hybrid partial least squares support vector machine model; optical emission spectroscopy; size 25 mum; size 80 mum; through silicon vias; Etching; Optical device fabrication; Silicon; Smoothing methods; Stimulated emission; Support vector machines; Through-silicon vias;
Conference_Titel :
Interconnect Technology Conference (IITC), 2013 IEEE International
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-0438-9
DOI :
10.1109/IITC.2013.6615575
