Title :
Design, fabrication and actuation of 4-axis thermal actuating image stabilizer
Author :
Lin, Chun-Ying ; Tsai, Tsung-Ying ; Chiou, Jin-Chen ; Chien, Chin-Ping
Author_Institution :
Inst. of Electr. & Control Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
This work presents a MEMS-based (micro-electro-mechanical system) thermal actuating image stabilizer. The proposed stage is designed as a 4-axis decoupling XY stage and 1.49 × 1.49 × 0.4 mm3 in size. This stabilizer is fabricated by Silicon on Isolator (SOI) process, including inductively coupled plasma (ICP) process and flip-chip bonding technique. The maximum actuating distance of the stage is 25 μm which is sufficient to resolve the anti-shaking problem in 3X optical zoom condition of a three mega pixels image sensor. According to the simulation of CoventorWare, the supplied voltage for the 25 μm moving distance is lower than 20 volts.
Keywords :
flip-chip devices; image sensors; microsensors; silicon-on-insulator; 4-axis thermal actuating image stabilizer; MEMS-based thermal actuating image stabilizer; antishaking problem; flip-chip bonding; image sensor; inductively coupled plasma process; micro-electro-mechanical system; silicon on isolator process; Actuators; Fabrication; Heating; Iterative closest point algorithm; Micromechanical devices; Springs; Thermal stability; MEMS; XY stage; thermal actuator;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on
Conference_Location :
Kaohsiung
Print_ISBN :
978-1-61284-775-7
DOI :
10.1109/NEMS.2011.6017327
