SU-8 micromachining process for millimeter and submillimeter-wave waveguide circuit fabrication

This paper presents a fabrication technique that utilizes a combination of photolithography and mechanical lapping to achieve a micromachining process to overcome the limitations of conventional machining for realization of millimeter and submillimeter waveguide components. The fabrication process for the waveguide sections begins with spin cleaning a silicon wafer. The SU-8 micromachined part will be assembled to the flange and measurements will be taken of the waveguide sections to characterize the micromachined waveguides.