Title :
A simple simultaneous switching noise (SSN) modeling and simulation methodology
Abstract :
Designers of complex integrated systems need a methodology to determine if there are any potential packaging related problems early in the design process. A quick, easy to use and understand SSN modeling and simulation methodology which consistently yields reasonably accurate results is presented here
Keywords :
integrated circuit modelling; integrated circuit noise; integrated circuit packaging; design; integrated circuit; modeling; packaging; simulation; simultaneous switching noise;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564806
