Electrodeposition and characterization of CoNiMnP-based permanent magnetic film for MEMS applications

Author

Sun, Xu-Ming ; Yuan, Quan ; Fang, Dong-Ming ; Zhang, Hai-Xia

Author_Institution

Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Peking Univ., Beijing, China

fYear

2011

fDate

20-23 Feb. 2011

Firstpage

367

Lastpage

371

Abstract

Electroplated CoNiMnP-based permanent magnetic films with thickness of 4μm, 25μm and 43.5μm were fabricated and tested. Composed of 76.38 wt% Co, 16.66 wt% Ni, 3.64 wt% P and 2.32 wt% Mn, the films exhibited good surface morphology. In the case of 4μm thick film, we successfully achieved a high lateral coercivity of 711Oe, a retentivity up to 8933Gs and an energy density of 16.9kJ/m³. The film thickness dependence of magnetic property was also investigated, showing a decrease of the retentivity and coercivity with the increase in thickness. In addition, it was observed that Zn as an additive could improve the surface morphology by eliminating micro cracks.

Keywords

cobalt compounds; electroplating; magnetic thin films; manganese compounds; micromechanical devices; nickel compounds; permanent magnets; surface morphology; CoNiMnP; MEMS; electrodeposition; energy density; magnetic property; microcracks elimination; permanent magnetic film; size 25 Mm; size 4 mum; size 43.5 mum; surface morphology; Coercive force; Magnetic films; Magnetic hysteresis; Magnetic properties; Magnetomechanical effects; Micromechanical devices; CoNiMnP; Electrodeposition; Hysteresis loops; Permanent film;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on

Conference_Location

Kaohsiung

Print_ISBN

978-1-61284-775-7

Type

conf

DOI

10.1109/NEMS.2011.6017369

Filename

6017369