SiGe front-end transceiver components for 802.11a WLAN applications

Author

Song, Nam Jin ; Kim, Dohyong ; Jinwook Burm ; Park, Jin Soo

Author_Institution

Dept. of Electr. Eng., Sogang Univ., Seoul, South Korea

fYear

2004

fDate

6-8 June 2004

Firstpage

527

Lastpage

530

Abstract

This paper presents the design and fabrication of 5-GHz Tx/Rx RF front-end components for IEEE 802.11a WLAN using 0.5 μm SiGe BiCMOS technology. All degeneration inductance employed only the down-bond inductors, and all matching circuits were employed on chip design except the input DC blocking capacitors. The effects of feedback resistance in the LNA on gain, input match, noise figure, and IP3 performance are investigated. The packaged LNA exhibited an NF of 2.5 dB with a gain of 16.5 dB at 5.25 GHz and an IIP3 of -10.5 dBm. The Rx/Tx mixers exhibited conversion gains of -2.1/-8.3 dB and IIP3s of 0.0/2.4 dBm, respectively. The driver amplifier achieved a gain of 26.5 dB and an OIP3 of 19.8 dBm. The overall NF and IIP3 of receive chain (from antenna to Rx mixer) were estimated to be 6.5 dB and -12.8 dBm, respectively.

Keywords

BiCMOS integrated circuits; Ge-Si alloys; MMIC amplifiers; MMIC mixers; feedback amplifiers; impedance matching; integrated circuit measurement; integrated circuit noise; microwave antennas; semiconductor materials; transceivers; wireless LAN; -2.1 dB; -8.3 dB; 0.5 micron; 16.5 dB; 2.5 dB; 26.5 dB; 5 GHz; 5.25 GHz; 6.5 dB; IEEE 802.11a WLAN applications; IIP3; IP3 performance; LNA feedback resistance; LNA gain; OIP3; Rx mixer; SiGe; SiGe BiCMOS technology; SiGe front-end transceiver components; Tx/Rx RF front-end components; antenna; chip design; conversion gains; degeneration inductance; down-bond inductors; driver amplifier gain; input DC blocking capacitors; input match; matching circuits; noise figure; packaged LNA; BiCMOS integrated circuits; Fabrication; Gain; Germanium silicon alloys; Inductance; Noise measurement; Radio frequency; Silicon germanium; Transceivers; Wireless LAN;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits (RFIC) Symposium, 2004. Digest of Papers. 2004 IEEE

ISSN

1529-2517

Print_ISBN

0-7803-8333-8

Type

conf

DOI

10.1109/RFIC.2004.1320674

Filename

1320674