• DocumentCode
    3281726
  • Title

    A TIA-based readout circuit with temperature compensation for MEMS capacitive gyroscope

  • Author

    Yin, Tao ; Wu, Huanming ; Wu, Qisong ; Yang, Haigang ; Jiao, Jiwei

  • Author_Institution
    Inst. of Electron., Chinese Acad. of Sci., Beijing, China
  • fYear
    2011
  • fDate
    20-23 Feb. 2011
  • Firstpage
    401
  • Lastpage
    405
  • Abstract
    This paper presents an integrated readout circuit based on trans-impedance amplifier (TIA) for MEMS capacitive gyroscope. The feedback resistors in TIA are realized in T-network pattern, which provides on-chip trans-impedance gains up to 22 MΩ. A CMOS temperature-variable gain circuit is proposed to compensate the temperature induced sensitivity variance in MEMS and TIA. The demodulator, instrumental amplifier and low-pass filter for signal processing are also integrated on chip. In order to simulate the response of the circuit to the vibrating gyroscope, a gyroscope simulation model implemented in Verilog-A HDL is established, which can take the MEMS parameters influence into account. The circuits measure 0.8×1.7 mm2 in a standard 0.35 μm CMOS process. The simulation results show that the TIA achieves a capacitive resolution of 0.42 aF/-Hz at 2.5 kHz with 75 ppm/°C temperature coefficient from a single 5 V supply.
  • Keywords
    CMOS analogue integrated circuits; capacitive sensors; compensation; gyroscopes; hardware description languages; low-pass filters; microsensors; operational amplifiers; readout electronics; CMOS temperature-variable gain circuit; MEMS capacitive gyroscope; T-network pattern; TIA-based integrated readout circuit; Verilog-A HDL; demodulator; feedback resistors; frequency 2.5 kHz; instrumental amplifier; low-pass filter; on-chip transimpedance amplifier; sensitivity; signal processing; size 0.35 mum; temperature compensation; voltage 5 V; Capacitance; Gyroscopes; Integrated circuit modeling; Micromechanical devices; Noise; Resistors; Temperature sensors; Capacitive readout; Gyroscope; Simulation model; Trans-impedance amplifier;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on
  • Conference_Location
    Kaohsiung
  • Print_ISBN
    978-1-61284-775-7
  • Type

    conf

  • DOI
    10.1109/NEMS.2011.6017377
  • Filename
    6017377