DocumentCode :
3281757
Title :
Fabrication and testing of a novel silicon probe for micromachined surface profilers
Author :
Jiang, Senlin ; Zhang, Dacheng ; Lin, Longtao ; Yang, Zhenchuan ; Yan, Guizhen
Author_Institution :
Dept. of Microelectron., Peking Univ., Beijing, China
fYear :
2011
fDate :
20-23 Feb. 2011
Firstpage :
406
Lastpage :
409
Abstract :
In this paper, we present the fabrication and testing of a novel probe for micromechanical surface profiler with double-ended tuning forks (DETFs) resonator as the displacement-sensing element. The probe is fabricated through the standard silicon-on-glass process developed by Peking University. The frequency variation of the DETF caused by the induced axial stress is directly proportional to the input displacement. Two stages micro-leverage mechanisms are introduced for force amplification to increase the overall sensitivity. The experimental results indicate the device has a nominal resonant frequency of 54.5 kHz under atmosphere at room temperature and the overall sensitivity is approximately 359.7 Hz/μm, which shows a good agreement with the simulation value of 330 Hz/μm using ANSYS™. Furthermore, the testing results depict the variation of frequency is linear to the displacement load within the range of 10μm.
Keywords :
displacement measurement; elemental semiconductors; glass; micromachining; micromechanical resonators; microsensors; silicon; vibrations; DETF resonator; axial stress; displacement-sensing element; double-ended tuning forks resonator; force amplification; frequency 54.5 kHz; frequency variation; microfabrication; microleverage mechanism; micromachined surface profiler; micromechanical surface profiler; resonant frequency; silicon-on-glass process; temperature 293 K to 298 K; Fabrication; Force; Optical resonators; Probes; Resonant frequency; Silicon; Testing; Displacement measurement; Double-ended-tuning-forks (DETFs) resonator; Microleverage; Silicon-Glass; bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on
Conference_Location :
Kaohsiung
Print_ISBN :
978-1-61284-775-7
Type :
conf
DOI :
10.1109/NEMS.2011.6017378
Filename :
6017378
Link To Document :
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