• DocumentCode
    3282166
  • Title

    Ultrashort-pulse laser microablation of aluminum oxide ceramics

  • Author

    Ho, Ching-Yen ; Wen, Mao-Yu

  • Author_Institution
    Dept. of Mech. Eng., Hwa-Hsia Inst. of Technol., Taipei, Taiwan
  • fYear
    2011
  • fDate
    20-23 Feb. 2011
  • Firstpage
    495
  • Lastpage
    498
  • Abstract
    The ablation of the aluminum oxide ceramics is theoretically investigated using the femtosecond laser in this paper. There is now a growing interest in laser micromachining using pulses of femtosecond duration. Among its advantages is the possibility machining hard and brittle materials that can be easily damaged by conventional drilling and cutting procedures. Femtosecond laser micromachining of ceramics can produce nanoscale patterns due to the laser pulse duration shorter than the relaxation time of heat transport among phonons. Laser ceramics ablation possesses another features, which include the phase transition from solid to vapor occurs without melt, the strong dependence of the thermophysical parameters and the volumetric absorption. The thermal process of femtosecond laser ceramics ablation is modeled by the heat conduction equation considering material evaporation and plasma plume absorption. The predicted ablation depth per pulse is compared with the available experimental data.
  • Keywords
    aluminium compounds; ceramics; evaporation; heat conduction; high-speed optical techniques; laser ablation; laser beam machining; light absorption; micro-optics; phonons; AlO; brittle materials machining; femtosecond laser micromachining; hard materials machining; heat conduction equation; laser ceramics ablation; material evaporation; phonons; plasma plume absorption; ultrashort-pulse laser microablation; volumetric absorption; Absorption; Ceramics; Laser ablation; Laser modes; Laser theory; Plasmas; formatting; insert; style; styling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on
  • Conference_Location
    Kaohsiung
  • Print_ISBN
    978-1-61284-775-7
  • Type

    conf

  • DOI
    10.1109/NEMS.2011.6017401
  • Filename
    6017401