Title :
Automatic measurement-based characterization of lossy MCM line using lumped elements
Author :
Corey, S.D. ; Kerns, K.J. ; Yang, A.T.
Author_Institution :
Washington Univ., Seattle, WA
Abstract :
A general approach is outlined for automatically extracting a SPICE model to characterize a measurable linear circuit over a frequency range. A lossy MCM transmission line is characterized and the simulated response is verified against measurement
Keywords :
SPICE; automatic testing; lumped parameter networks; multichip modules; packaging; transient response; transmission lines; SPICE model; automatic measurement-based characterization; impulse response; interconnect circuitry; lossy MCM line; lossy MCM transmission line; lumped elements; measurable linear circuit; packaging; simulated response;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564811
