DocumentCode
3282614
Title
Development of a surface mountable plastic package characterization technique
Author
Pham, A. ; Laskar, J. ; Zhou, Guoqing ; Hutchinson, Brian
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
fYear
1996
fDate
28-30 Oct 1996
Firstpage
147
Lastpage
149
Abstract
We present a method to characterize surface mountable plastic packages and packaged chips. A novel thin-film alumina substrate has been developed to mount plastic packages. The substrate establishes RF interconnections from plastic packages to coplanar waveguide (CPW) microprobes via CPW to package adapters (CPA). CPA calibration standards were fabricated based on the LRM error correction technique so that measurement reference planes can be set and shifted. Using this technique, we have successfully developed an electrical model for the SSOP-8 lead plastic package to 12 GHz
Keywords
calibration; coplanar waveguides; error correction; integrated circuit packaging; plastic packaging; surface mount technology; CPA calibration standards; LRM error correction technique; RF interconnections; SSOP-8 lead package; coplanar waveguide; electrical model; measurement reference planes; microprobes; package characterization technique; surface mountable plastic package;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location
Napa, CA
Print_ISBN
0-7803-3514-7
Type
conf
DOI
10.1109/EPEP.1996.564812
Filename
564812
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