Title :
Development of a surface mountable plastic package characterization technique
Author :
Pham, A. ; Laskar, J. ; Zhou, Guoqing ; Hutchinson, Brian
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
Abstract :
We present a method to characterize surface mountable plastic packages and packaged chips. A novel thin-film alumina substrate has been developed to mount plastic packages. The substrate establishes RF interconnections from plastic packages to coplanar waveguide (CPW) microprobes via CPW to package adapters (CPA). CPA calibration standards were fabricated based on the LRM error correction technique so that measurement reference planes can be set and shifted. Using this technique, we have successfully developed an electrical model for the SSOP-8 lead plastic package to 12 GHz
Keywords :
calibration; coplanar waveguides; error correction; integrated circuit packaging; plastic packaging; surface mount technology; CPA calibration standards; LRM error correction technique; RF interconnections; SSOP-8 lead package; coplanar waveguide; electrical model; measurement reference planes; microprobes; package characterization technique; surface mountable plastic package;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564812
