DocumentCode
3282720
Title
Analytical model for hole mobility in (001)-biaxially strained Si
Author
JianJun, Song ; HengSheng, Shan ; HeMing, Zhang ; HuiYong, Hu
Author_Institution
Sch. of Microelectron., Xidian Univ., Xi´´an, China
fYear
2011
fDate
15-17 April 2011
Firstpage
5708
Lastpage
5710
Abstract
The strained Si technology is a research emphasis in the modern microelectronic field. Hole mobility is an important physical parameter in strained Si materials. In this paper, an analytical model of the hole mobility of (001)-biaxially tensile strained-Si material grown on relaxed Si1-xGex(0≤ × ≤0.4) substrates, as a function of strain, doping concentration and different orientations was obtained. The quantized models can provide valuable references to the understanding on strained Si materials and the research on physical properties of devices.
Keywords
doping profiles; elemental semiconductors; hole mobility; silicon; (001)-biaxially tensile strained material; Si; Si1-xGex; doping concentration; hole mobility; microelectronic field; Doping; Effective mass; Microelectronics; Scattering; Silicon; Strain; mobility; scattering rates; strained Si;
fLanguage
English
Publisher
ieee
Conference_Titel
Electric Information and Control Engineering (ICEICE), 2011 International Conference on
Conference_Location
Wuhan
Print_ISBN
978-1-4244-8036-4
Type
conf
DOI
10.1109/ICEICE.2011.5777727
Filename
5777727
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