Lab-on-CMOS: Integrating microfluidics and electrochemical sensor on CMOS

This paper introduces an integration process capable of merging an electrochemical CMOS chip with a microfluidic structure to bring the performance benefits of on-CMOS sensors to lab-on-chip platforms. This new approach embeds a CMOS die into a carrier chip and provides a planar surface that supports complex microfluidic channels beyond the dimensions of a tiny CMOS die. The process provides a smooth surface suitable for patterning interconnects to reliably route chip pads to the edge of the carrier and for forming microfluidic mixers with detection channels that cross over the CMOS chip. This lab-on-CMOS process achieves high packing density and is suitable for batch production, opening new opportunities for next generation lab-on-chip devices.