DocumentCode

3283182

Title

Impurity Induced Voiding in Copper Interconnects

Author

Kovler, M. ; Buchbinder, M. ; Cohen, H. ; Rabkin, E. ; Estrin, Y.

fYear

2005

fDate

Dec. 7-9, 2005

Firstpage

109

Lastpage

110

Keywords

Adhesives; Annealing; Atomic measurements; Copper; Current density; Grain boundaries; Impurities; Tensile stress; Testing; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Device Research Symposium, 2005 International

Print_ISBN

1-4244-0083-X

Type

conf

DOI

10.1109/ISDRS.2005.1596002

Filename

1596002